基于ANSYS的电连接器温度变化仿真研究

Simulation Research on Temperature Change of Electrical Connector Based on Ansys

利用ANSYS仿真分析了温度循环和温度冲击下某型号电连接器温度场和接触件应力场的分布,分析了温度场和应力场的分布特点、接触件接触压力随温度循环范围和温度变化速率的变化规律,并进行了接触压力的试验验证。结果表明,接触件的温升值随环境温度循环范围的增大而略有增加,也会随着温度变化速率的增加而略有增加;与温度保持阶段相比,升温与降温阶段中,绝缘体的温度场分布更为杂乱,并且各等温层的温度梯度更大,绝缘体绝缘性能的破坏概率更大。

The distributions of temperature field and contact stress field of a certain type of electrical connector under temperature cycling and temperature shock were analyzed with ANSYS.The distribution characteristics of temperature field and stress field,contact pressure of contact part with temperature cycle range and temperature change rate were analyzed.The law of change was made and the test of contact pressure was verified.The results show that the temperature of the contact increases slightly with the increase of the ambient temperature cycle range,and also increases slightly with the increase of the temperature change rate;compared with the temperature maintenance phase,the temperature field distribution of the insulator is more disorderly in the period of temperature rise and decrease,and the temperature gradient of each isothermal layer is larger,and the insulation failure performance of the insulator is more likely to be destroyed.