功率对半导体硅基表面磁控溅射FeCrNiAl涂层性能的影响

Effect of Powers on Properties of FeCrNiAl Coating on Semiconductor Silicon Substrate by Magnetron Sputtering

为了提高半导体硅基表面电阻涂层的质量以及导电能力,选择磁控溅射工艺在其表面制得FeCrNiAl涂层,通过试验测试的方式对比了不同功率下得到的涂层硬度及其电阻率改变情况。结果表明:提高功率能够使涂层更易形成具有简单组织结构的固溶相,使涂层获得更强的结晶能力,并促进涂层的择优生长过程。FeCrNiAl涂层都形成了柱状结构,跟基底之间形成了紧密结合。提高功率后涂层中的晶粒发生增大,Cr与Fe在涂层内的原子分数增加,Ni原子分数减小。随着功率提高,溅射原子更易在基底表面发生扩散与快速迁移,使涂层以更快速度生长并形成更大尺寸的晶粒。FeCrNiAl涂层硬度达到772~952 HV,提高功率后,FeCrNiAl涂层硬度减小,晶粒粗化。随着功率提高,电阻率发生逐渐减小,形成了更粗大的柱状生长结构。

In order to improve the quality and conductivity of the resistance coating on the surface of semiconductor silicon,Fe Cr Ni Al coating was prepared on the surface by magnetron sputtering process,and the hardness and resistivity of the coating under different power were compared by experimental tests.Results showed that increasing the power could make the coating easier form the solid solution phase with simple structure,make the coating more crystalline,and promote the selective growth process of the coating.All the Fe Cr Ni Al coatings had the columnar structures and were tightly bonded to the substrate.After the increase of the power,the grains in the coating increased,and the atomic ratio of Cr and Fe in the coating increased,while the atomic ratio of Ni decreased.With the increase of power,the sputtering atoms were more prone to diffusion and rapid migration on the substrate surface,and the coating grew faster and formed with larger grains.Furthermore,the hardness range of Fe Cr Ni Al coating was 772-952 HV.After the increase of the power,the hardness of Fe Cr Ni Al coating decreased,with the grain enlarging.Furthermore,the resistivity gradually decreased and a larger columnar growth structure formed with the increase of power.