摘要
提出了一种三维结构的微小型电源模块架构和电路。该结构底层使用AlN基板解决了电源芯片的散热问题,顶层使用薄膜工艺加工高精度电阻以调整输出电压,通过盲腔和通孔等结构实现自屏蔽封装。实验结果表明,微小型电源模块尺寸为4.8 mm×4.5 mm,输入电压为6.5 V,输出电压为5.0±10% V,最大输出电流为3 A,适用于高密度集成的微波组件。
A micro three-dimension structure of linear regulator is put forward.AlN substrate is fabricated as the bottom layer to solve the problem of the chip heat dissipation,and high precision resistors are made by thin-fi lm process on the top layer to adjust the output voltage.A structure of blind slot and vias is used to realize the interconnection of the two layers.The experimental results show that the designed micro-linear regulator has a size of 4.8 mm×4.5 mm,the input voltage is 6.5 V,the output voltage is 5.0±10%V,the maximum output current is 3 A,which is suitable for the high density integration of microwave modules.
作者
蔡雪芳
张涛
王睿
马磊强
CAI Xuefang;ZHANG Tao;WANG Rui;MA Leiqiang(The 29th Research Institute of CETC,Chengdu 610036,China;Sichuan Province Engineering Research Center for Broadband Microwave Circuit High Density Integration,Chengdu 610036,China)
出处
《电子工艺技术》
2020年第6期322-324,共3页
Electronics Process Technology
关键词
三维结构
小型化
高密度集成
线性稳压电源
three-dimension structure
miniaturization
high density integration
linear regulator
