摘要
LTCC产品通过化学镀及BGA工艺可满足产品高密度集成的需求。研究了化学镀LTCC基板BGA焊盘的制作工艺。试验表明:后烧阻焊的BGA焊盘,经化学镀后,耐焊性及剪切强度均满足国军标要求,满足产品应用需求。
The technology of ENEPIG BGA pad on LTCC can meet the requirements of high-density integration of products.The manufacturing process of ENEPIG BGA pad on LTCC substrate is studied.The experiment shows that the soldering resistance and shearing strength of the BGA pad of post-fired after ENEPIG meet the requirements of national military standard and the products application requirements.
作者
张刚
董东
杨宇
ZHANG Gang;DONG Dong;YANG Yu(The 29th Research Institute of CETC,Chengdu 610036,China)
出处
《电子工艺技术》
2020年第6期325-327,341,共4页
Electronics Process Technology
