集成电路铜引线键合强度试验方法标准研究

Research on Test Method Standard of Copper Lead Bonding Strength for Integrated Circuits

通过对国内外引线键合强度相关试验方法标准进行的分析,重点对集成电路铜引线键合强度试验进行的球形键合剪切试验进行研究,并给出了相关试验程序、分离类型以及试验判据。研究表明,集成电路铜引线键合强度试验方法在现有标准中已有明确的规定,但缺少试验判据。该研究对开展集成电路铜引线键合强度试验所有帮助。

This paper describes the development and technology of integrated circuit bonding materials,by analyzing the test method of standards in the field of bond strength at home and abroad,the test procedure,test condition,failure mode and criterion of copper lead bonding strength test method are studied and analyzed.This paper is helpful for copper lead bonding strength test.