摘要
塑封工艺是集成电路封测中的关键环节,塑封工艺是将高温熔融的环氧树脂填充到特定的模具中,对芯片进行包覆。目前的模具主要根据试错经验进行设计,这种方法费时费力甚至有可能失败。而模流分析在设计塑封模具之时就可以模拟环氧树脂的流动,分析填充性,芯片偏移,金丝冲弯等现象。从实际应用出发,通过IPM、QFN产品的模流分析,总结出分析的标准流程,以及分析结果的评价。
The encapsulation process is an essential part of IC packaging and testing. The process involves filling a specific mold with high-temperature molten epoxy molding compound(EMC)to coat the chip. Current molds are mainly designed based on trial and error experience,this method is time-consuming, and may even fail. The mold flow analysis in the design of the mold could be simulate the epoxy resin flow, analysis of filling, chip offset, wire-sweep and warpage. In this article, the standard mold flow of analysis and the evaluation of analysis results are summarized, based on the analysis of IPM and QFN products from practical applications.
出处
《模具制造》
2020年第12期47-49,共3页
Die & Mould Manufacture
关键词
集成电路
塑封
模流分析
注射成型
IC
encapsulation
mold flow analysis
injection molding
