霍尔源溅射清洗工艺对离子镀TiN涂层结合性能的影响

Effect of Hall Source Sputtering Cleaning Process on Bonding Properties of Ion Plating TiN Coatings

为了研究溅射清洗工艺对基片表面特性的影响机理和规律,采用霍尔离子源产生氩离子束对基片进行溅射清洗,通过调整真空度来改变离子束的放电电压,以此对比不同放电电压下离子束清洗后基片的表面特性及制备涂层的膜基结合强度。实验结果表明,随着镀膜室内真空度的提高,离子束的放电电压逐渐升高、基片接触角值逐渐减小、基片表面粗糙度先减小后增加。制备涂层的膜基结合强度随离子束放电电压的升高呈现逐渐增加的趋势,最高可达60N。采用高能氩离子束溅射清洗后能够获得润湿性、延展性和清洁度都较为理想的基片表面,能有效提高涂层的结合性能。

Aiming for studying the mechanism and regularity of the effect of sputtering cleaning process on the surface characteristics of substrates,the Hall ion source was used to generate argon ion beam to clean substrates.The surface characteristics of substrates after ion beam cleaning under different discharge voltage and the bonding strength of coatings were then compared after changing discharge voltage of ion beam by adjusting the vacuum degree.The results show that with the increase of vacuum,the discharge voltage of ion beam increased gradually,the contact angle of substrate decreased gradually,and the surface roughness of substrate decreased first and then increased.The bonding strength of the coatings increased gradually with the increase of ion beam discharge voltage,up to 60N.It can be a concluded that the substrate surface could obtain good wettability,ductility and cleanliness after high energy argon ion beam sputtering cleaning,which can effectively improve the bonding performance of the coating.