电镀锡用锡补充装置及试验应用

Tin supplement device for tin electroplating and its test application

本文介绍了一种电解溶锡的装置,以及该装置的试验应用。所述装置包括电解槽,一对阴、阳电极,离子交换膜,电解循环槽;所述电解槽的形式为板框式,通过管线及泵与电解循环槽相连接;所述阴极是由钛板制成的镀铂钛电极,阳极是由馈电电极和金属锡粒组成,离子交换膜采用阳离子交换膜;所述阴、阳电极之间距离δ的范围是20mm≥δ>0;所述电解循环槽顶部设有盖子。通过该装置的试验应用,用该装置进行补锡,能减少锡泥的产生,降低生产成本。

This paper introduces a device for electrolytic tin dissolution and its test application.The device comprises an electrolytic cell,a pair of cathode and anode electrodes,an ion exchange membrane,and an electrolytic circulation cell;The electrolytic cell is of plate and frame type and is connected with the electrolytic cycle cell through pipelines and pumps;The cathode is a platinum-plated titanium electrode made of a titanium plate,the anode is composed of a feeding electrode and a metal tin particle,and the ion exchange film is a cation exchange film;The range of the distance between the negative and positive electrodes is 20mm≥ > 0;The top of the electrolytic circulation groove is provided with a cover.Through the test application of the device,tin filling with the device can reduce the production of tin mud,reduce the production cost.