小型断路器双金属片温升仿真研究

Simulation Study on Temperature Rise of Bimetal in MCB

利用Solidworks软件建立简化的双金属片模型,并利用Ansys仿真软件对简化模型进行仿真分析,得到了双金属片的温度分布以及最大形变量,同时制备完成相应的双金属片实物,并对实物进行了实验分析。对比分析仿真和实验结果,得到最大温度误差为0.4 K,达到稳定温升的时间也相同,验证了仿真方法的准确性。最后,针对不同焊接工艺的双金属片进行实验和仿真,得到了不同焊接工艺对双金属片温升的影响。

This paper uses SolidWorks software to establish a simplified bimetal model,and uses ANSYS simulation software to simulate the simplified model,and obtains the bimetal temperature distribution and the maximum shape variables.At the same time,the corresponding bimetallic sheet is completed.And the experimental analysis of the real object is carried out.By comparing the simulation and experimental results,the maximum temperature error is 0.4k and the time to reach stable temperature rise is the same,which verifies the accuracy of the simulation method.At last,the experiment and simulation of bimetal sheet with different welding process is carried out,and the influence of different welding process on bimetal sheet temperature rise is obtained.