石墨烯对微焊点微观组织及性能的影响

Effect of graphene on microstructure and property of micro-joint

为改善无铅钎料微焊点的微观组织及其抗剪切性能,在Sn-0.3Ag-0.7Cu钎料中添加石墨烯及镀铜石墨烯制备复合钎料。利用金相显微镜、扫描电镜及剪切机等测试手段对微焊点的微观组织、抗剪切性能及断口进行分析。结果表明,在Sn-0.3Ag-0.7Cu钎料中添加石墨烯能够抑制界面金属间化合物(IMC)的生长,提高Sn-0.3Ag-0.7Cu/Cu微焊点的抗剪切性能。石墨烯表面镀铜对抑制微焊点界面金属间化合物(IMC)层的生长及保持焊点剪切强度的效果更加显著。

This paper intends to improve microstructure and sheer property of the lead-free solder.The study is focused on preparing the composite solder by adding the graphene and copper-coated graphene in Sn-0.3Ag-0.7Cu solder and analyzing interface structure,shearing property and fracture morphology of micro-joints,using metallographic microscope,scanning electron microscopy analysis,shear test and fracture analysis.The results show that the addition of graphene to Sn-0.3Ag-0.7Cu solder enables the inhibition of the growth of interface IMC layer and thus the improvement in shearing strength of micro-joint.The addition of copper-plated graphene is remarkably more effective in inhibiting IMC layer growth and maintaining the shear strength of the solder joint.