摘要
介绍了集成电路制造业发展的主要趋势,包括复杂度、工作频率、器件性能、供电电压以及器件之间数据交换等。总结了微米级到纳米级CMOS工艺集成电路性能对应的工艺发展节点,讨论了技术演变对集成电路电磁兼容(EMC)的影响,并基于最近几年发表的一系列学术论文综述了集成电路电磁兼容的研究现状。
This paper presents the major trends in the development of the IC manufacturing industry,which include complexity,operating frequency,device performance,supply voltage,and data exchange between devices.The process development nodes corresponding to the performance of CMOS integrated circuits from micro to nano levels are summarized,the influence of technological evolution on the electromagnetic compatibility(EMC)of integrated circuits is discussed,and the current status of research on EMC of integrated circuits is reviewed through a series of academic papers published in recent years.
关键词
集成电路
电磁兼容
封装工艺
发展趋势
integrated circuit
electromagnetic compatibility
packaging technology
technological trends
