电镀地块污染成因分析与源头防控对策

Source analysis and control countermeasures of electroplating plot pollution

分析了75个电镀地块的超标污染物(包括重金属、氰化物与有机物),地块污染在水平方向上与电镀厂生产功能区基本对应,竖直方向上最深达到8 m。从污染物质、污染途径的角度解析了电镀地块污染的成因,如使用了涉及有毒有害的原料、生产过程的“跑、冒、滴、漏”以及地块本身防渗措施不足。提出了减少有毒有害原料使用、强化生产过程污染控制、加强生产场所自身防护等土壤污染预防对策建议。

The pollutants(including heavy metals,cyanide,and organic matters)in 75 electroplating plots were analyzed.The pollution in the horizontal direction was basically corresponding to the functional production areas of the electroplating plants,and the maximum depth was 8 m for the polluted soil.The causes of pollution in electroplating plots were analyzed from the perspective of pollutants and pollution ways,such as the use of toxic and harmful raw materials,the escaping,emitting,dripping,and leaking during production processes,and the lack of anti-seepage measures of the structures.Some suggestions for soil pollution prevention were presented,such as reducing the use of toxic and harmful raw materials,strengthening the pollution control during the production,and reinforcing the protection of the production site.