期刊文献+

基于MEMS的Ⅴ型硅电热执行器设计与制备 被引量:1

Design and Fabrication of Ⅴ-Beam Silicon Electro-Thermal Actuator Based on MEMS
下载PDF
导出
摘要 基于Ⅴ型电热执行器执行力大、输出位移小的特点,设计了单个Ⅴ型电热执行器,对其温度分布和位移进行理论计算及ANSYS有限元分析,并利用柔性杠杆原理设计了具有位移放大结构的阵列式Ⅴ型电热执行器,采用微电子机械系统(MEMS)工艺在绝缘体上硅(SOI)片上完成Ⅴ型电热执行器的制备,并搭建静态性能测试和动态性能测试平台。测试结果表明,在17Ⅴ驱动电压的激励下将阵列式Ⅴ型电热执行器的位移从约12.6μm放大到178.089μm,15 ms内达到稳定的工作状态,具有位移幅度大、响应时间短的特点。 A singleⅤ-beam electro-thermal actuator was designed based on its characteristics of large execution force and small output displacement.The theoretical calculation and ANSYS finite element analysis of the temperature distribution and displacement of theⅤ-beam electrothermal actuator were carried out.And the arrayⅤ-beam electro-thermal actuator with the displacement amplification structure was designed using flexible lever principle.TheⅤ-beam electro-thermal actuator was prepared on silicon-on-insulator(SOI)wafer by using microelectromechanical system(MEMS)technology,and the static and dynamic performance test platforms were built.The measurement results show that the displacement of the arrayⅤ-beam electro-thermal actuator is amplified from about 12.6μm to 178.089μm at the 17Ⅴdriving voltage,and the working state become stable within 15 ms.The arrayⅤ-beam electro-thermal actuator has the characteristics of large displacement range and short response time.
作者 保慧琴 张健 李婧 Bao Huiqin;Zhang Jian;Li Jing(School of Information Engineering,Xi′an Mingde Institute of Technology,Xi'an 710124,China)
出处 《微纳电子技术》 北大核心 2020年第12期998-1004,共7页 Micronanoelectronic Technology
基金 陕西省教育厅专项科研计划资助项目(20JK0951) 西北工业大学明德学院科研基金资助项目(2019XY01L02)。
关键词 微电子机械系统(MEMS) Ⅴ型电热执行器 位移放大 有限元分析 温度分布 响应时间 micro-electromechanical system(MEMS) Ⅴ-beam electro-thermal actuator displacement amplification finite element analysis temperature distribution response time
  • 相关文献

参考文献3

二级参考文献28

  • 1陈贤祥,彭春荣,白强,陈绍凤,夏善红.热驱动微型电场传感器[J].中国机械工程,2005,16(z1):161-163. 被引量:6
  • 2任子西.MEMS技术将会为战术导弹带来一场革命[J].战术导弹技术,2010(1):1-8. 被引量:9
  • 3张永宇.Model of Polysilicon Electro-thermal Micro Actuator and Research of Micro Scale Effect[J].Journal of Wuhan University of Technology(Materials Science),2004,19(B10):59-62. 被引量:2
  • 4胡明朗,魏瑞轩,邹凌云.微型飞行器的仿生感知与控制[J].传感器与微系统,2007,26(5):8-11. 被引量:4
  • 5Park Jae-sung,Chu Larry,Andrew D Oliver,et al.Bent-Beam Electrothermal Actuators-Part Ⅱ:Linear and Rotary Microengines[J].Journal of MicroElectroMechanical Systems,2001,10(2):255-262.
  • 6Yogesh B Gianchandani,Khalil Najafi.Bent-Beam Strain Sensors[J].Journal of Micro Electro Mechanical Systems,1996,5(1):52-58.
  • 7Wang Ye,Li Zhihong,Daniel T McCormick,et al.A Low Lateral MEMS Switch with High RF Performance[J].Journal of Micro Electro Mechanical Systems,2004,13(6):902-910.
  • 8Jin Qiu,Jeffrey H Lang,Alexander H Slocum.A Curved-Beam Bistable Mechanism[J].Journal of Micro Electro Mechanical Systems,2004,13(2):137-146.
  • 9Aaron A geisberger,Niladri Sarkar,Matthew Elllis,et al.Electrothermal Properties and Modeling of Polysilicon Microthermal Actuators[J].Journal of Micro Electro Mechanical Systems,2003,12(4):513-523.
  • 10Hergen Kapels,Robert Aigner,Josef Binder.Fracture Strength and Fatigue of Polysilicon Determined by a Novel Thermal Actuator[J].IEEE Transactions on Electro Devices,2000,47(7):1522-1528.

共引文献20

同被引文献6

引证文献1

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部