摘要
SiCp/Al复合材料具有广阔的应用前景,由于连接技术的制约,其实际应用受到限制。软钎焊技术是目前能够实现复合材料低温连接的理想方法之一。文章概括了SiCp/Al复合材料真空软钎焊技术的研究现状,着重介绍了采用锡基钎料进行复合材料真空软钎焊的研究工作,分析了目前SiCp/Al复合材料真空软钎焊技术中存在的一些问题,并提出了相应的改善措施和解决思路,以提高SiCp/Al复合材料真空软钎焊的接头质量。
SiCp/Al composites have broad application prospects,while their practical application is limited due to the restriction of connection technology.At present,soldering technology is one of the ideal methods to realize low temperature bonding of composite materials.This paper summarizes the research status of vacuum soldering technology for SiCp/Al composites.The research work of vacuum soldering of composite materials with tin based f iller metal is mainly introduced.The corresponding improvement measures and solutions are put forward to improve the quality of vacuum soldering joint of SiCp/Al composites.
作者
王东斌
徐冬霞
范晓杰
WANG Dongbin;XU Dongxia;FAN Xiaojie(School of Materials Science and Engineering,Henan Polytechnic University,Jiaozuo,Henan Province,454003 China;Guizhou University of Engineering Science,Bijie,Guizhou Province,551700 China)
出处
《科技创新导报》
2020年第24期82-84,共3页
Science and Technology Innovation Herald
基金
河南省高等学校重点科研项目计划2015年立项课题—SiCp/Al复合材料用新型纳米颗粒增强复合钎料的制备及组织性能研究(项目编号:15A430026)
河南理工大学青年基金项目—稀土元素对Al-Si-Cu共晶钎料组织和性能的影响及其作用机理研究(项目编号:Q2012-25A)。
