最优炉温曲线与确定其工艺参数问题

Optimal Furnace Temperature Curve and Determination of Process Parameters

随着当下科学技术的发展,在电子焊接领域中,元器件材料在工艺方面对原有SMT技术~([1])有了新的挑战。传统的焊接方式愈加不能满足技术要求。回焊炉利用一种半自动控制方式,通过控制相应温区的温度和传送带的速度,提高生产效率,降低生产成本。本文根据牛顿冷却定理建立薄材传热模型~([3]),在温腔内形成温度场,使用集总参数分析法,简化电路板中心炉温曲线求解问题。在其基础上通过各温区焊接中心温度确定电路板传送时间和速度。在梯形温度曲线~([4])法模型中,简化最优炉温曲线及传送速度求解问题,利用RSS(Ramp-Soak-Spike Profile)升温-保温-峰值曲线~([5])及延长峰值温度,建立梯形温度曲线模型求解。

In the field of electronic welding,the process of component materials has a new challenge to the original SMT[1]technology.The traditional welding method is increasingly unable to meet the technical requirements.The reflow furnace utilizes a semi-automatic control method to improve production efficiency and reduce production costs by controlling the temperature of the corresponding temperature zone and the speed of the conveyor belt.In this paper,according to Newton’s cooling theorem to establish a thin material heat transfer model[3],the formation of a temperature field in the temperature cavity,the use of set-total-parameter analysis to simplify the circuit board center furnace temperature curve to solve the problem.On its basis,the solder center temperature in each temperature zone is used to determine the circuit board transfer time and velocity.In the trapezoidal temperature profile[4]model,the optimal furnace profile and the transfer speed are simplified and solved by using the RSS(Ramp-Soak-Spike Profile)ramp-hold-peak curve[5]and extended peak temperature to establish a trapezoidal temperature profile model.