摘要
随着TWS蓝牙耳机的兴起,耳机PCB主板从原始的硬板+线缆连接逐步向高阶HDI软硬结板方向发展。本研究选取一款应用于TWS蓝牙耳机的2阶HDI软硬结合板,分享其工艺路线、技术特点等一些关键技术。
With the development of TWS Bluetooth headset,headphone PCB motherboard develops from original rigid board plus cable connection to high-level HDI Rigid-flex board.This study selects a 2 level HDI Rigid-flex board for TWS Bluetooth headset product and shares some key technologies such as process and characteristic technology.
作者
杨先卫
黄金枝
叶汉雄
黄生荣
Yang Xianwei;Huang Jinzhi;Ye Hanxiong;Huang Shenrong
出处
《印制电路信息》
2020年第12期20-23,共4页
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