一种高散热铜基印制电路板制造探索

The exploration for a high heat dissipation copper based PCB manufacturing

文章介绍开发一款高散热铜基印制板,根据要求选择了一款低流胶的导热性绝缘层材料。由于该导热材料是低流胶且对压合有特殊要求,通过压合参数试验,压合结果料温曲线符合要求,热应力测试合格。钻孔和铣板是铜基板的制作难点,通过工艺参数试验,钻孔孔粗及披锋小,铣板SET边光滑毛刺小,可以满足品质要求,最终开发顺利完成。

This paper introduces the development of a high heat dissipation copper based PCB.According to the requirement,a low flow adhesive thermal insulation material is selected.As the heat-conducting material is low flow adhesive and has special requirements for pressing,the material temperature curve of pressing results meets the requirements and the thermal stress test is qualified through pressing parameter test.Drilling and routing are the difficulties in the production of copper base plate.Through the process parameter test,the drilling results show that the hole is thick and the front is small,and the set edge is smooth and the burr is small,which can meet the quality requirements,and the final development is completed successfully.