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基于沙渠石渠转化机制制备PDMS基导热复合材料 被引量:6

Preparing PDMS-Based Thermal Conductive Composite Based on Sand and Stone Canal Transformation Mechanism
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摘要 提出了基于沙渠、石渠转化机制的复合材料导热性能强化的方法,其中,导热网络作为"渠",热流和聚合物基体分别被视作水流和沙石,由传统共混法制备的"沙渠"导热网络会阻碍热导率的提高,这是由于,当热量在"沙渠"导热网络中传导时,被聚合物基体吸收并耗散。通过空间限域强制组装法(SCFNA)和添加刚性粒子2种方法,可以将"沙渠"导热网络转化为"石渠"导热网络,减少聚合物吸收和耗散的热量,提高了网络的热传导能力,从而提高了复合材料热导率。通过实验验证了2种方法的有效性,在SCFNA法的作用下,PDMS/15%SCF复合材料的热导率达到了11.423 W/mK,与传统共混法相比,约提高了9.8倍;当加入5%的低导热系数(0.15 W/mK)的中空玻璃微珠时,热导率提高至13.004 W/mK,与传统共混法相比,约提高了11.3倍。 The method for thermal conductivity enhancement based on sand and stone canal transformation mechanism was proposed.the thermal conductive network(TCN)was regarded as a canal,while the heat flux and polymer matrix were regarded as water flow and sand respectively.The reason why the thermal conductivity couldn’t be effectively increased was that heat was absorbed and dissipated by the polymer matrix during conduction while it was transformed in the sand canal TCN by traditional compounding method.The sand canal TCN could be transformed to stone canal TCN by SCFNA method and adding rigid particles in order to reduce heat dissipation and improve thermal conductivity of composite.The experiment also was designed to verify this mechanism.Compared with traditional compounding method,the thermal conductivity of composite system of poly(dimethylsiloxane)/short carbon fiber(PDMS/SCF)reached to 11.423 W/mK by SCFNA method,increased by 9.8 times.The thermal conductivity even presented an unexpected enhancement to 13.004 W/mK after adding 5%glass bubble with a relatively low TC of 0.15 W/mK,increased by 11.3 times.
作者 司武炎 吴大鸣 孙靖尧 刘颖 苏逢春 SI Wuyan;WU Daming;SUN Jingyao;LIU Ying;SU Fengchun(Engineering Research Center for Polymer Processing Equipment,Ministry of Education,College of Mechanical and Electrical Engineering,Beijing University of Chemical Technology,Beijing 100029,China)
出处 《塑料》 CAS CSCD 北大核心 2020年第6期1-5,共5页 Plastics
关键词 导热材料 沙渠石渠 空间限域 强制压缩 刚性粒子 thermal conductive polymer composite sand and stone canal spacial confining forced assembly rigid particle
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