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侧氰基芳醚硅芳炔树脂的制备与表征 被引量:1

Preparation and characterization of a silicon-containing arylacetylene resin with cyano groups
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摘要 在无水三氟甲磺酸锌催化下通过2,6-双-(4-乙炔基苯氧基)-苯腈和二甲基二氯硅烷室温反应制备了侧氰基芳醚硅芳炔树脂(CNSA);采用1H-NMR、FTIR、DSC、TGA等分析测试技术表征了CNSA的结构与性能。结果显示,CNSA树脂具有好的溶解性和宽的加工窗口,可在较低温度(<200℃)下发生固化反应;树脂固化物具有好的热性能,在50~400℃之间无玻璃化转变,在N2中质量损失5%的温度Td5达512℃;T300碳纤维平纹布/CNSA(CF/CNSA)复合材料的室温弯曲强度达383.8 MPa,弯曲模量为62.9 GPa。 A silicon-containing arylacetylene resin with cyano groups(CNSA resin)was formed by reaction of 2,6-bis-(4-ethynylphenoxy)-phenylnitrile polymerized with dimethyldichlorosilane by the catalysis of anhydrous zinc trifluoromethane sulfonate at room temperature.The structure and properties of the CNSA resin were characterized by 1H-NMR,FTIR,DSC and TGA analysis techniques.The results show that the CNSA resin has good solubility and a wide processing window.The curing reactions of the CNSA resin take place at low temperature(<200℃).The cured CNSA resin has good heat resistance.There is no glass transition in the temperature range of 50−400℃.The decomposition temperature of 5%mass loss Td5 is 512℃in nitrogen.The flexural strength and the flexural modulus of T300 carbon fiber cloth/CNSA(CF/CNSA)composites are 383.8 MPa and 62.9 GPa at room temperature,respectively.
作者 马满平 戴妮娉 李传 刘晓天 袁荞龙 黄发荣 MA Manping;DAI Niping;LI Chuan;LIU Xiaotian;YUAN Qiaolong;HUANG Farong(Key Laboratory for Special Polymer Materials and Related Technology,School of Materials Science and Engineering,East China University of Science and Technology,Shanghai 200237,China)
出处 《复合材料学报》 EI CAS CSCD 北大核心 2020年第12期3035-3042,共8页 Acta Materiae Compositae Sinica
基金 中央高校基本科研业务费专项资金(50321042017001)。
关键词 氰基 含硅芳炔树脂 催化聚合 复合材料 固化反应 cyano group silicon-containing arylacetylene resin catalytic polymerization composite curing reaction
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