大功率COB-LED的翅片散热器优化研究

Optimization of fin Radiator for High Power Cob-led

由于COB封装的LED具有大功率、集成度高和成本低等优点,使得其得到广泛的应用。但由于大功率LED存在转换率低、散热性能差等缺点,限制了LED照明产业的发展。而散热性能的好坏则是产业发展的主要问题,因此,不断优化散热器的结构来降低LED芯片结温是当务之急。为了降低成本,使用ANSYS workbench软件进行仿真分析,通过研究翅片散热器的翅片厚度、翅片高度和底板厚度对芯片结温的影响,进行散热器的结构优化。

Nowadays,cob packaged LEDs are widely used due to high power,high integration and low cost.However,because of the low conversion rate and poor thermal performance of high-power LED,the development of LED lighting industry is limited.Among them,heat dissipation is the main problem of current development.Therefore,it is urgent to optimize the structure of heat sink to reduce the junction temperature of LED chip.In or­der to reduce the cost,ANSYS Workbench is used to simulate and analyze the influence of fin thickness,fin height and bottom plate thickness on chip junction temperature,and then optimize the structure of radiator.