电子器件动态热管理软硬件实施方法

The implementation of software and hardware for dynamic thermal management of electronic devices

电子器件的热问题已经成为制约其高集成度下性能持续发展的瓶颈.软硬件结合实现高效且可靠的动态热管理是突破热限制的关键路径,然而其中涉及的软件算法设计和散热硬件优化仍然面临诸多挑战.本文针对电子器件动态热管理中温度感知困难、散热负荷波动、冷却能耗高等难点,设计了基于矩阵分解的热传感器布置优化及在线温度场重构算法,提出了利用大尺寸石墨纳米片的高热导率(~35 W(m K)-1)复合相变材料构建方法,验证了基于固体吸附剂解吸热利用的高焓值(等效1950 J/g)相变散热策略,研究了基于吸附式制冷的数据中心余热回收节能冷却系统.这些方法聚焦电子器件热管理的发展趋势和关键需求,从算法到硬件,从单个器件到系统集群的各个角度,提出软硬兼施的解决实施方案,从而为未来电子器件热管理提供新的思路.

As the integration of electronic devices increases,thermal issues have become a key obstacle to performance improvement of them.Combining the hardware and software methods could be a reasonable way to the efficient and robust dynamic thermal management.But the algorithm design and heat dissipation enhancement remains an enormous challenge in these fields.This paper systematically introduces the efforts that our team have put in thermal aware,passive thermal regulation and cooling sysytem energy saving.Specifically,online temperature field reconstruction algorithm,based on matrix decomposition and sampling theory,is designed.Composite phase change materials with high thermal conductivity(~35 W(m K)-1)is developed.Furthermore,a novel phase change cooling strategy,by utilizing desorption process of water inside sorbents,with high enthalpy(equivalent to 1950 J/g)is proposed.Then the energy-saving cooling system of data center based on adsorption refrigeration is studied.These technologies focus on the core concerns of dynamic thermal management of electronic devices,and provide solutions from different scales.Finally,we discuss the remaining challenges and give an outlook on the future.