占空比对铜/金刚石复合材料表面离子镀AlN膜层组织与性能的影响

Effect of Duty Factor on Microstructure and Properties of AlN Coating Ion-plated on Copper/diamond Composite

采用多弧离子镀技术在铜/金刚石复合材料表面制备AlN薄膜以提高其表面电绝缘性能,并探讨占空比对AlN膜层组织形貌及性能的影响。结果表明:AlN膜层在(220)晶面择优生长,(002)、(101)晶面取向生长。随占空比(20%、40%、60%)增加,AlN膜层表面颗粒趋于均匀细小、致密化,且亮白色颗粒明显减少,但占空比过高时出现大颗粒及亮白色颗粒明显增多现象。Cu/金刚石复合材料表面镀AlN膜层后,热导率略微降低,但其表面电绝缘性得到较大改善。占空比为40%时所得AlN膜层致密均匀、电绝缘性最优。

The AlN coating was prepared on the surface of Cu/diamond composite by multi-arc ion plating technology to improve the surface electrical insulation performance.the effect of duty factor on the microstructure and properties of AlN coating was discussed.The results show that the AlN coating grow preferentially on(220)crystal face and in orientation on(002)and(101)crystal face.With the increase of duty factor(20%,40%,60%),the surface particles of AlN coating tend to be uniformly fine and densified,and the bright white particles decrease significantly,but the duty factor is too high,and the large particles and bright white particles increase significantly.The thermal conductivity of Cu/diamond composite decrease slightly after AlN coating,but the surface electrical insulation is improved greatly.When the duty factor is 40%,the AlN coating is compact and uniform,and the electrical insulation is optimal.