化学镀银工艺改进及其在5G通信领域中的应用探讨

Improvement of Electroless Silver Plating Process and Its Application in 5G Communication Field

传统还原型化学镀银工艺产出的产品均匀性差,严重影响到导电效果,且产品厚度已不能满足立体成形电路(3D-MID)日益提高的生产工艺要求。在置换型化学镀银工艺的试验基础上,通过文献查阅、正交试验以及实验室测试和SEM扫描检测,对置换型化学镀银工艺进行系统研究和改进,得出了化学镀银的最优工艺条件及配比:银离子1 g/L,非离子表面活性剂2 g/L,水杨磺酸20 g/L,聚乙二醇2 mL/L,硝酸1 mL/L,HEDTA 10 g/L,温度52℃,pH值0.85,时间10 min,能够使银镀层厚度达到1μm以上,且产出工件均匀性良好。通过系列循环试验发现此项工艺具有较好的良率产出,且镀液的寿命明显提升,降低了工业生产的成本,能够满足成形电路(3D-MID)技术的发展需求,使其更好地应用于5G通信领域中。

The uniformity of the products produced by the traditional reduced electroless silver plating process is poor,which seriously affects the conductive effect,and the thickness of the products can not meet the requirements of the production process. In this paper,the displacement type electroless silver plating process was studied systematically and improved through literature review,orthogonal experiment,laboratory test and SEM scanning test,based on the experiment of displacement type electroless silver plating process. The optimized process was as follows: Ag+1 g/L,nonionic surfactant 2 g/L,salicylic acid 20 g/L,PEG 2 mL/L,HNO31 mL/L,HEDTA 10 g/L,52 ℃,pH = 0.85,and 10 min. The thickness of the obtained silver coating reached more than 1 μm,and the uniformity of the output workpiece was good. Through a series of cycle experiments,it was found that this process had a good yield,and the life of the plating solution was significantly improved,which reduced the cost of industrial production,and met the development needs of 3D-MID technology,making it better applied in the field of 5G communications.