导电胶粘接可伐载板工艺的仿真与优化

Simulation and Optimization for Conductive Adhesive Bonding Technology of the Kovar Alloy Substrate

导电胶是一种很有潜力的互连材料,其粘接可靠性是制约其应用的主要因素。基于对某混频模块粘接失效的分析,探索温度试验条件及载板尺寸对可伐载板粘接可靠性的影响。通过仿真和试验设计,研究不同温度试验条件下不同尺寸载板在粘接界面处的应力分布情况,并优化了可伐载板粘接工艺。结果表明,温度试验条件越严苛,载板尺寸越大,可伐载板粘接可靠性越差,可采取环氧绝缘胶加固或柔性导电胶粘接的方式对其粘接工艺进行优化。

Conductive adhesive is a promising interconnecting material,and bonding reliability of conductive adhesive has become one of the difficulties in its application.Based on the bonding failure analysis of a mixing module,this paper explores the influence of temperature test conditions and the size of substrate on the bonding reliability of the Kovar alloy substrate.Through simulation and experimental design,the stress distribution at the bonding interface of different size substrate under different temperature test conditions is studied,and the bonding technology of the Kovar alloy substrate is also optimized.The results show that the harsher the temperature test condition and the larger the size of substrate,the worse the bonding reliability of the Kovar alloy substrate.The bonding technology of the Kovar alloy substrate can be optimized by insulating epoxy adhesive or flexible conductive adhesive.