厚铜板阻焊起泡原因分析及改善

Cause analysis and improvement of foaming of solder mask on heavy copper board

目前厚铜印制板的应用越来越多,使其在阻焊印刷过程中工艺参数管控与板面清洁工作就显得尤为重要。本文主要分析厚铜板油墨起泡的原因及探究改善措施;分析线路毛边长度、油墨粘度、阻焊印刷参数、静电对油墨起泡的影响后,通过新增二流体补充蚀刻、管控油墨粘度、静置加吸真空、调整印刷室湿度,针对性改善油墨起泡。

More and more heavy copper PCB are used.It is particularly important to control the process parameters and clean the surface of thick copper plate in the process of welding resistance printing.This paper mainly analyzes the causes of thick copper plate ink bubbling and explores the improvement measures.After analyzing the effect of line burr length,ink viscosity,printing parameters of welding resistance and static electricity on ink foaming,the ink foaming can be improved by adding two fluids to supplement etching,controlling ink viscosity,adding vacuum and adjusting the humidity of the printing room.