LGA器件焊点缺陷分析及解决

Ananysis and solution of solder joint defects in LGA devices

文章针对LGA器件回流焊后常见的空洞和锡珠等缺陷,对其产生的原因进行了分析。通过对LGA器件采用预上锡回流工艺和印制板钢网一字架桥开口的方式,提升回流焊过程中焊膏中挥发气体的逸出,并通过对比试验,找到合适的预上锡钢网尺寸,解决了生产中LGA器件焊接常见的空洞大等缺陷。

In this paper,the causes of defects such as voids and solder ball after reflow soldering of LGA devices are analyzed.Through the pre tin reflow process and the way of bridging the opening at the LGA devices of PCB steel mesh,the escape of volatile gas during reflow soldering process is improved.Through the comparative test,theappropriate size of pre tin mesh is found,and the detects such as large voids are solved.