超高速光互连系统级封装技术前沿研究

Research on the Forefront of Ultra-High-Speed Optical Interconnect System-Level Packaging

光互连系统级封装技术是用光互连在封装尺度上代替铜互连,以突破目前芯片间通信低速度瓶颈。超高速光互连系统级封装的目标是开发出可集成光子收发器,并嵌入到现代尖端的系统级封装中(SiP)中,以提高并行计算系统的数据传输效率或速度。文章介绍了超高速光互连系统级封装关键技术及前沿研究情况,通过分析IMEC、Intel、BAE系统公司等研究机构的开发现状和技术发展路线,论述了光互连SiP关键技术的发展趋势。

Optical interconnect system-level packaging technology uses optical interconnects to replace copper interconnects at the package scale to break the current low speed bottleneck of inter-chip communication. The goal of ultra-high-speed optical interconnect system-level packaging is to develop integrated photon transceivers and to embed them in modern, state-of-the-art system-in-package(SiP) to improve the data transmission efficiency or speed of a parallel computing system. The key technologies and cutting-edge research of ultra-high-speed optical interconnect system-level packaging were introduced in this article. By analyzing the development status and technological development routes of research institutes such as IMEC, Intel, and BAE Systems, the development trend of optical interconnect SiP technology was discussed.