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乙烯基酯树脂/热膨胀微球复合体系的固化过程研究 被引量:1

Study on Curing Kinetics of Vinyl Ester Resin with Expancel Series
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摘要 乙烯基酯树脂基复合材料的固化是成型过程关键步骤之一,涉及到模具结构、模压工艺的确认等。本文采用差示扫描量热法(DSC)在不同的升温速率分别研究了纯树脂以及加入热膨胀微球以后的固化行为。利用Kissinger方程和Crane方程对DSC测试数据进行分析,计算得到复合体系固化反应的表观活化能Ea、指前因子A、固化反应级数n等固化动力学参数。此外,利用外延法确认了固化温度,为固化工艺提供了依据。 The curing behavior of vinyl composite system is essential element of the molding process.It involves mold design and moulding process.The curing behaviors of vinyl resign,vinyl resign/expancel series composite system were observed by dynamic calorimeter(DSC)at different heating rates.After analyzing the results of DSC test,the curing kinetics parameters of system were calculated by Kissinger and Crane method,including apparent activation energy Ea,pre-exponential factor A,curing reaction orders n and other curing kinetic parameters.In addition,the curing temperature was calculated by extrapolation,which provided the basis for curing process.
作者 彭新龙 江林鹤 PENG Xin-long;JIANG Lin-he(Guangdong Brand Builder New Materials Co.,Ltd.,Guangdong Zhaoqing 526238,China)
出处 《广州化工》 CAS 2021年第2期45-47,111,共4页 GuangZhou Chemical Industry
关键词 乙烯基酯树脂 热膨胀微球 动力学参数 固化温度 vinyl ester resign expancel series kinetics parameters curing temperature
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