高功率组件热斑风险研究

Study on hot spot risk of high-power module

基于光伏组件热斑原理,建立了光伏组件热斑温度模型,模拟不同高效技术组件热斑温度并设计实验评估其热斑温度。实验数据显示,同档位350 W半片多晶组件热斑温度较单晶PERC组件低20~30℃,大硅片半片多晶400 W与半片多晶350 W组件相比热斑温度相当。模拟结果与实验数据具有较好的吻合性,偏差在2%以内。数据显示大硅片半片多晶高效技术降低热斑风险,提高了光伏组件可靠性,为高功率组件热斑问题的解决提供了方向。

A hot spot temperature model for solar module was constructed based on the hot spot principle of photovoltaic modules to simulate the various high-wattage module hot spot temperature,and the experiment was designed.The results show that the designed 350 W half-cell polycrystalline modules can lower hot spot temperature by 20-30℃than that of single-crystalline PERC module,and the hot spot temperature of large silicon 400Whalf-cell polycrystalline module and 350 W half-cell polycrystalline module is equivalent.The simulation results are in good agreement with the experimental data,and the deviation is within 2%.The results show that large silicon half-cell polycrystalline high-efficiency technology reduces the risk of hot spot,improves the reliability of photovoltaic modules,and provides a direction for solving the hot spot problem of high-power modules.