电解高纯金的制备与表面织构研究

Study on Preparation and Surface Texture of Electrolytic High Purity Gold

用670和800 A/m^2的电流密度对4N金进行电解提纯,并利用X射线衍射(XRD)和电子背散射衍射(EBSD)技术对电沉积产物的底面和表面进行极图绘制和微观组织重构。结果表明,样品纯度均达到6N以上;EBSD与XRD所得织构结果基本一致。电沉积金的表面和底面均存在织构,较大的电流密度会弱化织构。受外延生长效应和过渡生长效应的影响,2样品与阴极基板接触的表面均存在{111}纤维织构,电沉积自由表面均存在{001}纤维织构,电流密度的变化导致2样品的织构也发生变化。随着电沉积过程的进行,晶粒尺寸长大。

The 4N gold was purified by electrolytic purification process with current densities of 670 and 800 A/m^2.The pole figures of electrodeposited products were measured by X-ray diffraction(XRD)and electron backscatter diffraction(EBSD)techniques.The results showed that the purity of the gold samples was above 6N,and that the texture results obtained by EBSD and XRD were basically the same.The texture existed on both surface and bottom of electrodeposited Au,and a larger current will weaken the texture.Affected by the epitaxial growth effect and the transition growth effect,the{111}fiber texture existed on the surfaces of the two samples contacted with the cathode substrates,and{001}fiber texture existed on the free surface of electrodeposition.The texture of the two samples changed with the current density.As the electrodeposition process proceeded,the grain size increased.