摘要
对塑封球栅阵列(PBGA)封装器件Sn37Pb焊点进行了正弦振动、随机振动实验,得到各个载荷下焊点的疲劳寿命结果。建立了三维有限元模型,进行与实验条件一致的有限元分析,计算焊点的应力;将实验结果与有限元计算相结合,并基于Steinberg寿命预测模型,发展了随机振动载荷下焊点疲劳寿命预测方法。结果表明,疲劳寿命模型预测结果与实验结果吻合较好,该方法可应用于PBGA封装焊点在随机振动载荷下的疲劳寿命评估,为PBGA封装器件的设计与使用提供指导。
The sinusoidal and random vibration tests of Sn37Pb soldered plastic ball grid array(PBGA)assemblies were conducted to obtain the vibration lifetime of solder joints.A finite element analysis(FEA)was performed to obtain the maximum stresses at critical solder joints.A method was proposed for the vibration lifetime prediction of PBGA solder joints based on vibration failure tests,FEA and an adjusted Steinberg fatigue life prediction model.The results show the model is effective in predicting the fatigue life of solder joints under random vibration condition.The methodology can be applied to provide models and tools for the thermo-mechanical reliability design of PBGA packaging.
作者
秦飞
别晓锐
陈思
安彤
QIN Fei;BIE Xiaorui;CHEN Si;AN Tong(Institute of Electronics Packaging Technology and Reliability,College of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology,Beijing 100124,China;Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,China Electronic Product Reliability and Environmental Testing Research Institute,Guangzhou 510610,China)
出处
《振动与冲击》
EI
CSCD
北大核心
2021年第2期164-170,共7页
Journal of Vibration and Shock
基金
国家自然科学基金(11872078)
北京市自然科学基金(2182011)
国家重点研发计划(2018YFB0105400)。
