基于格林函数的半导体桥三维非稳态传热模型

A Green's Function-based 3D Unsteady Heat-transfer Model for SCB

为提高半导体桥(SCB)与数字电路的集成度,将SCB焊接在印刷电路板(PCB)上。对于该种封装的特殊边界条件,半球传热模型不再适用,需要建立一个可以准确描述其传热过程的模型。格林函数引入建模过程,使用长方体而非球体模型,边界条件更接近真实情况,建立一种SCB三维非稳态传热模型。对SCB器件通以恒流后进行红外测温实验,同时使用传热模型计算温度,对比模型计算值与实验数据,最高温度误差不超过4℃,温度分布及温升趋势也较为吻合。结果表明,该模型较准确地表现了PCB封装SCB器件的非稳态传热过程。

To improve the integration of a semiconductor bridge(SCB)with digital circuit,the semiconductor bridge is welded on a printed circuit board(PCB).As the hemispherical heat-transfer model is no longer suitable for the special boundary conditions of this kind of package,a model which can accurately describe its heat-transfer process needs to be established.Green's function is applied to the modeling process,and a cuboid model instead of a sphere one is used so that the boundary conditions are closer to the real situation.Then a 3D unsteady heat-transfer model of semiconductor bridge is established.An infrared temperature measuring experiment is carried out after the semiconductor bridge device is connected with a constant current source,and the heat-transfer model is used to calculate the temperature.Comparison between the calculated value and the experimental data shows that the maximum temperature error is less than 4℃,and the distribution and rising trend of the temperature are also consistent.This result shows that the model can accurately represent the unsteady heat-transfer process of semiconductor bridge device packaged by a PCB.