可变温红外探测器中测杜瓦设计

Variable temperature infrared detector test Dewar design

介绍了一种中测变温杜瓦装置(简称变温杜瓦),可实现多个温度条件下(60~300 K)连续测试芯片性能。与传统的中测液氮杜瓦相比,变温杜瓦体积较小,可与制冷机耦合,从而实现多个温度可调。另外,将变温杜瓦的框架部件设计为可拆卸结构,既可以兼容多种规格的芯片,又提高了芯片性能的封装效率。通过试验测试,变温杜瓦组件芯片衬底区域的温度均匀性为0.6 K,装入芯片且通电测试10 min内,变温杜瓦的控温稳定性为0.69 K,能够满足项目的使用要求(控温稳定性在±3 K)。

This article introduces a test Dewar variable temperature Dewar device(referred to as variable temperature Dewar),which can continuously test chip performance under multiple temperature conditions(60~300 K).Compared with the traditional middle-measured liquid nitrogen Dewar,the variable temperature Dewar is smaller and can be coupled with the refrigerator to achieve multiple temperature adjustments.In addition,the temperature-variable Dewar frame components are designed as a detachable structure,which can not only be compatible with chips of various specifications,but also improve the test efficiency of the chips performance.Through experimental tests,the temperature uniformity of the chip substrate area of the variable temperature Dewar component is 0.6 K.Within 10 minutes after the chip is loaded,the temperature control stability of variable temperature Dewar is 0.69 K,which can meet the needs of the project(Temperature control stability is within±3 K).