摘要
目的探讨半导体激光切除术对急性智齿冠周炎患者牙龈愈合及血清炎性因子的影响。方法选取揭阳市人民医院2019年2月至2020年2月接收的60例急性智齿冠周炎患者,采用随机数字表法分为对照组(30例)和观察组(30例)。对照组患者给予传统手术切除治疗,观察组患者给予半导体激光切除术治疗,两组患者均于术后随访3个月。比较两组患者术后1周、1个月牙龈愈合等级;比较两组患者术后1周、1个月及3个月疼痛评分;比较两组患者术前、术后1个月牙周指标;比较两组患者术前、术后1周血清炎性因子水平。结果术后1个月观察组牙龈愈合0级患者占比显著高于对照组,2级患者占比显著低于对照组;与术后1周比,术后1~3个月两组患者疼痛评分均逐渐降低,且观察组显著低于对照组;与术前比,术后1个月两组患者探诊深度(PD)、临床附着水平(CAL)、出血指数(BI)、松动度(MOB)水平均降低,且观察组PD、CAL、BI水平显著低于对照组;与术前比,术后1周两组患者血清C-反应蛋白(CRP)、肿瘤坏死因子-α(TNF-α)水平均降低,且观察组显著低于对照组(均P<0.05)。结论半导体激光切除术可有效促进急性智齿冠周炎患者牙龈愈合,并减轻其疼痛感,同时改善牙周情况,抑制机体炎症反应。
Objective To investigate the effect of semiconductor laser resection on gingival healing and serum inflammatory factors in patients with acute wisdom tooth pericoronitis.Methods 60 patients with acute wisdom tooth pericoronitis accepted by Jieyang People's Hospital from February 2019 to February 2020 were divided into the control group(30 cases)and the observation group(30 cases)according to the random number table method.Patients in the control group were treated with traditional surgical resection,and patients in the observation group were treated with semiconductor laser resection.Both groups were followed up for 3 months after surgery.Compared the gingival healing grades of patients between the two groups 1 week and 1 month after surgery;Compared the pain scores of patients between the two groups 1 week,1 month and 3 months after surgery;Compared the periodontal indexes of patients between the two groups before and 1 month after surgery;Compared the levels of serum inflammatory factors between the two groups before and 1 week after surgery.Results 1 month after surgery,the proportion of patients with gingival healing grade 0 of the observation group was significantly higher than that of the control group,and the proportion of grade 2 was significantly lower than that of the control group;Compared with 1 week after surgery,the pain scores of the two groups of patients decreased gradually from 1 to 3 months after surgery,and the observation group was significantly lower than the control group;Compared with before surgery,the probing depth(PD),clinical attachment level(CAL),bleeding index(BI)and looseness(MOB)levels of patients of the two groups 1 month after surgery reduced significantly,and the PD,CAL and BI levels of the observation group were significantly lower than those of the control group;compared with before surgery,the serum C-reactive protein(CRP)and tumor necrosis factor-α(TNF-α)levels of the two groups of patients reduced significantly 1 week after surgery,and the observation group was significantly lower than those of the control group(all P<0.05).Conclusion Semiconductor laser resection can effectively promote the healing of the gums of patients with acute wisdom tooth pericoronitis and reduce their pain,while improving the periodontal condition and inhibiting the body's inflammatory response.
作者
黄娜芝
谢逸瑞
李洁银
HUANG Nazhi;XIE Yirui;LI Jieyin(Department of Stomatology,Jieyang People's Hospital,Jieyang,Guangdong 522010,China)
关键词
急性智齿冠周炎
半导体激光切除术
牙龈愈合
炎性因子
疼痛
Acute wisdom tooth pericoronitis
Semiconductor laser resection
Gingival healing
Inflammatory factors
Pain