微电铸图形表面平面度提升技术

Technology of Improving Surface Flatness of Micro-electroforming Circuit Patterns

微电铸技术是制备小尺寸、高精度金属微结构的常用技术。然而,在进行铜微电铸时,产品表面电流密度的分布呈现边缘大、中间小的趋势,从而导致了电铸层厚度分布不均匀的现象。此外,对于同一电铸图形,其边缘和中心的高度分布也不同。采用高精度机械研磨技术结合化学机械抛光技术,可提升微电铸图形的表面平面度。研究表明,152.4 mm幅面的微电铸图形的总厚度变化小于5μm。

Micro-electroforming is frequently applied to fabricate small size and high precision metal microstructures.However,when copper electroforming is carried out,the current density on the surface tends to be larger at the edge and smaller in the middle,the nonuniformity of current distribution will lead to the inhomogeneous electroforming thickness.Besides,the height distribution of the edge and middle of the same electroforming pattern is different.High precision mechanical grinding combined with chemical mechanical polishing technology is applied to improve the flatness of the electroforming pattern surface.The research indicates that for 6-inch electroforming pattern,the total thickness variation of 152.4 mm micro electroformed pattern is less than 5μm.