高导热复合基板制造技术

Manufacturing Technology of Composite Substrate with High Thermal Conductivity

高导热复合基板是一种内夹厚铜芯的特种印制电路板,包括多材料叠层体系对位精度控制、基于塞孔镀平的孔中孔结构加工、复杂异形盲槽成型等多项关键技术。具有高密度互联、多功能复合、高功率散热等突出特点,可与LTCC和HTCC基板形成互补优势,应用在T/R、变频、频综等微波组件和射频母板中。

Composite substrate with high thermal conductivity is a special printed circuit board which is inserted a thick copper core.The key technologies include the alignment tolerance control for multi-material laminated system,the realization of hole in hole structure based plated over filled via,the process of complicated blind cavity and so on.With the outstanding characteristics of high density connection,a lot of functions integrated and cooling for high power,the composite substrate can form complementary advantages with LTCC and HTCC substrates,and can be used for microwave module and RF backplane,such as T/R module,frequency conversion module and frequency synthesizer.