摘要
研究了一种可应用于微波器件气密封装的钎焊工艺设计。采用有限元仿真软件计算了搭接型微波器件钎焊封装模型,以Sn63Pb37焊料钎焊外引线和盖板为基础,探索出钎焊密封的边界条件和适当的工艺参数并延伸拓展。试验证明,能够实现盒体与盖板的气密性钎焊封装且不影响后续喷涂工艺。使用扫描电镜对焊缝进行检查,焊缝致密无空洞,金属化层厚度约1μm。应用钎焊密封的微波器件,其性能指标在封装前后无变化。
A soldering process design of hermetic packaging for microwave device is studied.The finite element simulation software is used to calculate the soldering package model of lap type microwave devices.Based on the soldering of outer lead and cover plate with Sn63Pb37,the boundary conditions and appropriate process parameters of packaging are explored and extended.The results show that the hermetic packaging between the box and the cover plate can be realized without affecting the subsequent coating process.Scanning electron microscope(SEM)is used to examine the solder joints.The solder joints is compact without voids,and the thickness of IMC layer is about 1μm.The performance of the microwave devices has no change after packaging.
作者
姚友谊
胡蓉
许冰
YAO Youyi;HU Rong;XU Bing(Chengdu Seekon Microwave Communication Co.,Ltd.,Chengdu 610091,China;The 29th Research Institute of CETC,Chengdu 610036,China)
出处
《电子工艺技术》
2021年第1期23-25,29,共4页
Electronics Process Technology
基金
四川省级科技计划项目(2018GZ0116)。
关键词
微波器件
气密封装
钎焊
microwave device
hermetic packaging
soldering
