LGA器件焊点缺陷分析及解决措施

Analysis and Solution of Solder Joint Defects for LGA Devices

针对LGA器件回流焊后常见的空洞和锡珠等缺陷,对其产生的原因进行了分析。通过对LGA器件采用预上锡回流工艺和印制板钢网LGA器件处一字架桥开口的方式,使回流焊过程中焊膏的挥发气体加速逸出。通过对比试验,找到合适的预上锡钢网尺寸,解决了LGA器件焊接中常见的空洞大的缺陷问题。

The causes of defects such as voids and solder beading after reflow soldering of LGA devices are analyzed.Through the pre tinning reflow process and the way of bridging the opening at the LGA devices of PCB steel mesh,the escape of volatile gas during reflow soldering process is improved.Through the comparative test,the appropriate size of pre tinning mesh is found,and the defects such as large voids in LGA soldering are solved.