摘要
针对PCB在SMT后出现的通孔开路问题,本文结合孔铜断裂失效案例,通过CT、金相切片、SEM及热分析等分析手段来进行论证,分析PCB孔铜断裂的失效机理,并给出了预防控制建议。
For the open circuit failure of PCB plated though hole(PTH)after SMT,the article analyzed the failure mechanism of PTH,which combines actual failure cases.Using the analytical methods of CT/Metallurgical structure/SEM/thermal performance test,the causes of the PTH failure was analyzed,and the prevention measure was put forward.
作者
刘顺华
刘兴龙
王君兆
Liu Shunhua;Liu Xinglong;Wang Junzhao(CRRC Qingdao Sifang Rolling Stock Research Institute Co.,Ltd.Qingdao 266000,China;Meixin Consulting Co.,Ltd.Shenzhen 518034,China;Meixin Testing Technology Co.,Ltd.Shenzhen 518034,China)
出处
《印制电路信息》
2021年第2期38-40,共3页
Printed Circuit Information
关键词
印制电路板
孔金属化
孔铜断裂
金相组织
失效分析
Printed Circuit Board
Plated Through Hole
The Fracture of PTH
Metallurgical Structure
Failure Analysis
