静电吸附对全自动粘片的影响及控制方法

Effect and Control Method of Electrostatic Adsorption on Automatic Die Bonding

静电是电子封装中重要的防控点,不仅对芯片电性能有致命威胁,其静电力学效应引起的吸附作用更会严重干扰小尺寸芯片的全自动组装,降低产品的成品率和一致性,为提升有效的静电防护能力,保证集成电路封装质量及可靠性,通过研究静电吸附的基本原理,说明小尺寸芯片更容易产生静电吸附效应的原因,列举控制和消除静电的方法,阐述静电吸附对全自动粘片过程的影响,进而提出有效的控制措施。实验表明,该控制方法可去除粘片之前和粘片过程中的多余电荷,起到了良好的小尺寸芯片全自动粘结效果,对于高可靠集成电路,特别是小尺寸芯片集成电路的组装具有重要意义。

Static electricity is an important prevention and control point in electronic packaging,which not only poses a fatal threat to the electrical performance of chips,but also seriously interferes with the automatic assembly of small-sized chips and reduces the yield and consistency of products.In order to improve the effective electrostatic protection ability and ensure the quality and reliability of IC packaging,by studying the basic principle of electrostatic adsorption,the reasons why small-sized chips are more likely to produce electrostatic adsorption effect are explained,the methods of controlling and eliminating static electricity are listed,the effect of electrostatic adsorption on the automatic die bonding process is expounded,and then effective control measures are put forward.Experiments show that the control method can remove the excess charge before and during die bonding,and has a good automatic bonding effect for small-sized chips,which is of great significance for the assembly of highly reliable ICs,especially ones with small-sized chips.