环境老化对底部填充胶性能的影响

The Effect of Environmental Aging for Performance of Underfill

焊球可靠性是电子封装过程中重点关注的问题之一,底部填充胶被引入电子封装领域用来匹配基板和芯片之间的热膨胀系数,从而保护焊球,提高焊球的可靠性,但是底部填充胶的引入也会出现老化过程中一些由材料本体变化造成的可靠性问题。该文主要研究了几种老化处理对底部填充胶热机械性能和黏接性能的影响。对于胶水的热机械性能,经过水热老化处理和高温存储老化处理后的变化最为明显。对于胶水的黏接性能,老化处理在有机基底和无机基底表现出的影响并不相同。其中,对无机基底影响较为明显的是高温存储,而对有机基底影响较为明显的是水热老化处理。

The reliability of solder joints is one of the key concerns in electronic packaging.Underfill was employed to match the thermal expansion coefficient between the substrate and the IC chip in electronic packaging,thereby protecting the solder joints and improving the reliability of the solder joints.However,the reliability of solder bumped flip chip will be affected by the changes in performance of underfill during the aging process.Therefore,the effects of several aging treatments on the thermo-mechanical properties and adhesion of underfill were studied in this paper.The thermo-mechanical properties of the underfill have the most obvious changes after hydrothermal aging treatment and high-temperature storage life treatment.There is no obvious similarity on organic interface and the inorganic interface for adhesion of underfill.High temperature storage has the most obvious effect on the adhesion of inorganic interfaces,while hydrothermal aging has the most obvious effect on the organic interfaces.