导热垫片导热性能的影响因素分析

Analysis of Influence Factors of Thermal Conductivity of Thermal Pad

分析硬度以及测试条件对导热垫片导热性能的影响。结果表明:随着硬度的增大,导热垫片的导热系数减小,热阻增大,适宜硬度为70度;随着测试压力的增大,导热垫片的导热系数增大,热阻减小,适宜测试压力为345 kPa;随着测试温度的升高,导热垫片的导热系数增大,热阻减小,适宜测试温度为80℃;减少导热垫片内部气体空穴,能够增大导热粉体接触几率,有助于改善导热垫片的导热性能。

The influence of hardness and test conditions on the thermal conductivity of the thermal pad was analyzed.The results showed that,with the increase of hardness,the thermal conductivity decreased and the thermal resistance increased,and the suitable hardness was 70 degrees.With the increase of the test pressure,the thermal conductivity increased and the thermal resistance decreased,and the suitable test pressure was 345 kPa.With the increase of the test temperature,the thermal conductivity increased and the thermal resistance decreased,and the suitable test temperature was 80℃.Reducing the gas hole in the thermal pad could increase the contact probability of the thermally conductive powder and help to improve the thermal conductivity of the thermal pad.