WIA-PA系统级芯片设计与原型系统搭建

The Design and Prototype System Building of WIA-PA Based System-on-a-Chip

本文设计了一款基于ARM Cotex-M3内核,集成具有自主设计的WIA-PA无线通信模块、AES-128硬件加解密模块以及其他通用模块的WIA-PA工业无线系统级芯片WIASoC2400。对芯片进行流片与测试,结果表明,该芯片支持WIA-PA工业无线网络,接收灵敏度可达-100dBm,具有更高的同步精度和更低的协议栈实现难度。同时,搭建了基于该芯片的工业物联网原型系统,同步精度可达30μs,能够稳定高效地完成数据传输与执行器控制。

In this paper,we design the system-on-a-chip(SoC)WIASoC2400 which is based on the ARM Cortex M3 core and combines the self-designed WIA-PA wireless communication module and AES-128 hardware accelerator module besides some general modules.We did some experiments to test the performance of WIASoC2400.The results show that WIASoC2400 can fully support the industrial wireless network(IWN)based on WIA-PA,the receiver sensitivity of which reaches-100 dBm.The WIA-PA IWN based on WIASoC2400 has a higher synchronization accuracy and easier implementation.Besides,We built an WIASoC2400 based industrial internet of things(IIoT)prototype with synchronization accuracy reaching 30μs,which can transmit data and control the operators reliably and effectively.