摘要
表面贴装技术的大规模应用,使得研究其组装质量具有极其重要的意义。表面贴装元器件的封装特点,使其更易受到湿气的影响,在组装时导致失效。该文浅析了表面贴装元器件由于潮湿引起的失效现象和原因,并介绍了潮湿敏感元器件的防护措施。
The large-scale applicati on of surface mount tech no logy makes it extremely importa nt to study its assembly quality.The packaging characteristics of surface mount device make it more susceptible to moisture and cause failure during assembly.This article discusses the failure phenomena and causes of surface mount devices due to moisture,and introduces the protective methods for moisture sensitive devices.
作者
李佳力
Li Jia-li(Jiangsu Electronic Information Product Quality Supervision&Inspection Institute(Jiangsu Information Security Evaluation Center),Jiangsu Wuxi 214073)
出处
《电子质量》
2021年第2期8-11,共4页
Electronics Quality
关键词
表面贴装元器件
潮湿敏感度等级
潮湿防护措施
Surface Mounted Device
Moisture Sensitivity Level
Moisture protection method
