LGA器件焊接可靠性工艺技术研究

Research on Welding Reliability Technology of LGA Package Device

针对栅格阵列封装(Land Grid Array Package,LGA)器件焊接不良的问题,分析了不同尺寸和形状的钢网开孔设计以及不同的焊接方法对LGA焊接性能的影响,确定最优的焊接工艺参数。研究表明:0.8 mm开孔尺寸的钢网保证了LGA焊接后焊料铺展的均匀性,采用真空汽相焊的方式可以极大地降低焊点的气孔率,实现LGA高可靠性的焊接.

Aiming at the problem of poor welding performance of land grid array package device,the causes are analyzed.The different sizes and shapes of steel mesh and the different welding methods are adopted to explore their influence on LGA welding performance.The optimal welding process parameters were determined.The results show that 0.8mm steel mesh ensures the uniformity of solder spreading after LGA welding.Vacuum vapor welding can greatly reduce the porosity of solder joints,realize LGA high reliability welding.