美国电子复兴计划进展分析与启示

Analysis on Progress of DARPA Electronics ResurgenceInitiative and Its Inspiration

本文首先从实施背景、攻关方向、项目演进与部署、组织模式等方面深入分析了美国国防高级研究计划局于2017年启动的“电子复兴计划”,总结其项目发展特点和研发重点变化情况。接着,深入分析“电子复兴计划”组织模式的创新特点,即基于“挑战”的政产学研“协作”模式以及助推技术转化的桥梁作用。最后,提出进一步加强我国半导体芯片领域的研发规划和创新实施的建议,包括:明确半导体芯片领域的顶层战略计划,理清现有技术挑战、整合已有研发基础、促进技术迭代发展;营造开放共享的军民融合环境,发挥军民两用技术的桥梁作用,形成更加紧密的协同创新模式;完善技术创新的组织管理模式,发挥研发和人才的最大组合能动性,促进技术组合集成,推进成果应用。

In this paper,in-depth analyses of Electronics Resurgence Initiative(ERI),launched by DARPA in 2017,are conducted in terms of its background,three primary research thrusts,projects deployment and progress,and organization model.Further more,characteristics of its projects development and adjustment of its R&D focuses are analysed and com-pared respectively.Then,innovations of its organization model are presented,which consist of challenge-based public-private collaborative partnership,and the role of boosting technology transformation.Finally,some suggestions are putted forward to further strengthen the R&D strategic plans and its innovation implementation in semiconductor industry in China:clarify the top-level strategic plan in semiconductor industry,analyse the existing technology challenges,integrate the existing R&D foundation,and promote the iterative development of technology;create an open and shared military-civilian integration envi-ronment,play the bridge role of dual-use technology and form a closer collaborative model;improve the organization and management mode of technological innovation,maximize enabling combination of research and talents,and promote technolo-gy portfolio and application.