摘要
In the past few decades,the Moore’s Law has been the revolutionary force for our integrated circuit(IC)industry.However,the tremendous challenges faced in continuous transistor physical down-scaling and the unprecedented demands for computing and storage capabilities require our urgent search for strategies and solutions to integrate diverse materials,devices,circuits,and architectures in a 3D vertically stacked manner so that they can orchestrate in the most effective way to provide significantly enhanced functionalities as well as superior speed,energy,bandwidth,form fact,and cost.
