低介电损耗环氧树脂复合材料的研究进展

Research Progress in Low Dielectric Loss Epoxy Resin Composites

物联网(IoT)和第五代移动通信技术(5G技术)的飞速发展,对封装材料和元器件基材的介电性能提出了更高的要求,开发具备低介电常数以及低介电损耗的环氧树脂(EP)成为重要的研究方向。本文从原料、固化条件、填料、共混共聚和层状复合等几个方面对制备低介电损耗环氧复合材料的方法进行了综述,同时简要分析了各种研究方案获得低介电损耗的主要原因,最后例举了低介电环氧树脂目前仍存在的一些问题,并对未来的研究方向进行了展望。

With the rapid development of the Internet of Things(IoT)and the fifth generation mobile communication technology(5G),the higher level of requirement has been put forward for the dielectric performance of packaging materials and component substrates.The development of epoxy composites with a low dielectric constant and low dielectric loss has become an important research direction.Some methods for the preparation of low‑dielectric epoxy composites were reviewed from the aspects of raw materials,curing conditions,fillers,blends,copolymerization,and multi‑layers cast.The mechanisms for low‑dielectric composites were also analyzed.Finally,some problems in the preparation of low‑dielectric epoxy resins were discussed,and some prospects for future research were provided.