摘要
文章评述了导体表面粗糙度对高频化信号传输的影响。提出加入偶链剂与铜表面进行化学的键合作用和树脂类聚合作用来提高低粗糙度铜表面与树脂类之间结合力方法,而采用氮杂环的咪唑类偶链剂是PCB制造中解决结合力的优选。
This paper reviews the influence of conductor surface roughness on high frequency signal transmission.In order to improve the adhesion between low roughness copper surface and resin,the chemical bonding and resin polymerization methods of adding coupling agent and copper surface are proposed.The imidazole coupling agent with nitrogen heterocycle is the best choice to solve the adhesion in PCB manufacturing.
出处
《印制电路信息》
2021年第3期9-12,共4页
Printed Circuit Information
关键词
表面粗糙度
偶链剂
化学键合作用
层间结合力
Surface Roughness
Coupling Agent
Chemical Bonding
Interlayer Adhesion
