印制电路板背钻孔方法改进

Improvement to the manufacturing method of PCB back drill

背钻孔铜残桩(stub)的大小是影响通信类印制电路板(PCB)信号传输完整性的一个重要因素;本文以机械控深钻制作背钻的方式为研究对象,针对目前行业常用的几种背钻方法缺点;设计并验证了一种新型不使用导电盖板的控深背钻方法,以提高背钻孔铜残桩的控制精度和生产效率。

The size of back board copper stub is an important factor affecting the signal transmission integrity of communication PCB.In this paper,the way of making back drill by mechanical controlled deep drill is taken as the research object,aiming at the shortcomings of several back drill methods commonly used in the industry.A new control deep back drilling method without conductive cover is designed and validated to improve the control accuracy and production efficiency of copper residual piles.